Utilising innovation and development combined with extensive in-house capabilities we have become a leading supplier of Thermal Management Solutions to a global market.
The range has evolved from standard products through to brazed cold-plates keeping pace with the challenges of semi-conductor development.
Efficient cooling of electronics equipment is essential to prolong component life and improve system reliability.
To facilitate this, we offer a wide range of cooling solutions.
A comprehensive range of high performance extruded aluminium heat sinks suitable for board-mounting and
use with a wide variety of power devices.
Our design department is available to assist in the design and manufacture of a range of high performance heat
sinks utilising a moving airstream to meet your specific requirements. Our products include Coldfin® and Coldcube®.
The high density heat exchanger assembly is designed to provide maximum performance from minimum volume,
giving greater flexibility for configuration and space management.
Coolant paths are machined into the base plate before vacuum brazing and are optimised for the magnitude and positioning of the various heat loads to ensure an even temperature distribution across the entire assembly.
A varied range of industries are catered for from consumer applications to space research programmes.
Typical markets include:
• Consumer and industrial electronics
• Drives and controls
• Stage and screen lighting