Aluminium Thermopuck

The aluminium Thermopuck™ is a vacuum brazed assembly manufactured from a stack of pre-cut aluminium grids and outer covers. The exceptionally high performance, coupled with a low pressure drop, is due to the unique internal geometry of the aluminium stack. This configuration also ensures a uniform flow of coolant under the semiconductor providing an even temperature distribution ensuring maximum performance and operational life of your component.

Copper Thermopuck

Similar in construction to the aluminium Thermopuck™ the copper version utilises the improved thermal conductivity of copper to provide even greater efficiency from a slimmer package. Five different fitting positions allows for the shortest possible coolant route in a stacked assembly.

Aluminium/copper coldplate
For screwed semiconductors

Using the same basic construction as the Thermopuck™ these devices offer the same advantages in weight and performance but are more suitable for modular components.

Coolant paths are machined into the base plate before vacuum brazing and are optimised for the magnitude and positioning of the various heat loads to ensure an even temperature distribution across the entire assembly. If necessary the assembly may also include aluminium grids or corrugation in order to increase the surface area in contact with the coolant to achieve maximum efficiency.

Coldplate-1

This is simplified version of the cold plate manufactured by incorporating a stainless steel or copper tube within an aluminium block. Coolant flow path can be optimised to suit the distribution of the heat load on the block. The block can also be machined to facilitate component mounting. Fluid couplings are attached to the tube before insertion to ensure a water tight seal.